• Flexible/Rigid XPS Insulation Material Is Suitable for Valuable Packaging
  • Flexible/Rigid XPS Insulation Material Is Suitable for Valuable Packaging
  • Flexible/Rigid XPS Insulation Material Is Suitable for Valuable Packaging
  • Flexible/Rigid XPS Insulation Material Is Suitable for Valuable Packaging
  • Flexible/Rigid XPS Insulation Material Is Suitable for Valuable Packaging
  • Flexible/Rigid XPS Insulation Material Is Suitable for Valuable Packaging

Flexible/Rigid XPS Insulation Material Is Suitable for Valuable Packaging

Usage: Gifts, Jewelry, Cosmetic, Food, Digital Products, Drinks, Toy, Health Care Products
Material: XPS Insulation Board
Thermal Conductivity: 0.027
Figra: 72W/S
Oxygen Index: 32.5%
Compressive Strength: 200~1000 Kpa
Samples:
US$ 10/Piece 1 Piece(Min.Order)
| Request Sample
Customization:
Gold Member Since 2023

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  • Overview
  • Product Description
  • Producing Process
  • Detailed Photos
  • Our Advantages
Overview

Basic Info.

Model NO.
PIR Foam Board
Thermal Resistance
0.96 (M2`K)/W
Water Absorption
0.4% (96h)
Transport Package
Plastic Film
Trademark
Beipeng
Origin
China
HS Code
3921110000
Production Capacity
2000/Cbm

Product Description

Product Description


XPS foam board is a kind of rigid extruded polystyrene thermal insulation material. Taking polystyrene resin as the main component, adding a certain proportion of additives, through the Berstorff imported production line, in strict accordance with the ISO quality management system control conditions, heating extrusion molding by a special process, products are formed with a honeycomb shape finally. High performance rigid foam with closed cell structure.

Due to the special honeycomb structure of the product, the interconnecting walls have a certain thickness without voids. The final extrusion forms a product with a uniform structure and excellent thermal insulation performance, and the product itself has good high compression resistance, moisture resistance and moisture resistance.

Producing Process

 

1. Heftynest extruded board process-CO2 foaming process

2. The cells are small and uniform in size

3. The link wall between the cells is uniform in thickness

4. High closed cell rate

5. No secondary foaming phenomenon

6. No residual solids and no foaming


 

Beipeng XPS Foam Board Specification
Thermal Conductivity W/m2·K ≤0.030
Dimensional stability % ≤1.5
Compressive strength kPa 200 250 300 350 400 450 500 600 800
Tensile strength Mpa 0.20
Water absorption % ≤1.5
Combustion performance   B1, B2
Density kg/m2 22-35 Customization is accaptable
Length mm 1200 2400
Width mm 600 1200
Thickness mm 20    25    30    40 50    60     70    80 90   100 120   130
 
 
Detailed Photos

Flexible/Rigid XPS Insulation Material Is Suitable for Valuable PackagingFlexible/Rigid XPS Insulation Material Is Suitable for Valuable PackagingFlexible/Rigid XPS Insulation Material Is Suitable for Valuable PackagingFlexible/Rigid XPS Insulation Material Is Suitable for Valuable PackagingFlexible/Rigid XPS Insulation Material Is Suitable for Valuable Packaging

Our Advantages

 

Flexible/Rigid XPS Insulation Material Is Suitable for Valuable Packaging


 

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