Beipeng Ultra-Low Thermal Conductivity XPS Insulation Board Suitable for Food Factory Construction

Product Details
Customization: Available
Forming Way: Extrusion
Application: Functional Components
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  • Beipeng Ultra-Low Thermal Conductivity XPS Insulation Board Suitable for Food Factory Construction
  • Beipeng Ultra-Low Thermal Conductivity XPS Insulation Board Suitable for Food Factory Construction
  • Beipeng Ultra-Low Thermal Conductivity XPS Insulation Board Suitable for Food Factory Construction
  • Beipeng Ultra-Low Thermal Conductivity XPS Insulation Board Suitable for Food Factory Construction
  • Beipeng Ultra-Low Thermal Conductivity XPS Insulation Board Suitable for Food Factory Construction
  • Beipeng Ultra-Low Thermal Conductivity XPS Insulation Board Suitable for Food Factory Construction
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  • Overview
  • Product Description
  • Producing Process
  • Application Field
  • Detailed Photos
  • Our Advantages
Overview

Basic Info.

Model NO.
xps
Markets Served
Building & Construction
Customized
Customized
Color
Single Color
Surface Finishing
Finished
Thermal Conductivity
0.027
Figra
72W/S
Oxygen Index
32.5%
Compressive Strength
200~1000 Kpa
Thermal Resistance
0.96 (M2`K)/W
Water Absorption
0.4% (96h)
Transport Package
Plastic
Trademark
Beipeng
Origin
China
HS Code
392111
Production Capacity
2000/Cbm

Product Description

Product Description

XPS foam board is a kind of rigid extruded polystyrene thermal insulation material. Taking polystyrene resin as the main component, adding a certain proportion of additives, through the Berstorff imported production line, in strict accordance with the ISO quality management system control conditions, heating extrusion molding by a special process, products are formed with a honeycomb shape finally. High performance rigid foam with closed cell structure.

Due to the special honeycomb structure of the product, the interconnecting walls have a certain thickness without voids. The final extrusion forms a product with a uniform structure and excellent thermal insulation performance, and the product itself has good high compression resistance, moisture resistance and moisture resistance.
 

Beipeng XPS Foam Board Specification
Thermal Conductivity W/m2·K ≤0.030
Dimensional stability % ≤1.5
Compressive strength kPa 200 250 300 350 400 450 500 600 800
Tensile strength Mpa 0.20
Water absorption % ≤1.5
Combustion performance   B1, B2
Density kg/m2 22-35 Customization is accaptable
Length mm 1200 2400
Width mm 600 1200
Thickness mm 20    25    30    40 50    60     70    80 90   100 120   130
Producing Process

1. Beipeng extruded board process-CO2 foaming process

2. The cells are small and uniform in size

3. The link wall between the cells is uniform in thickness

4. High closed cell rate

5. No secondary foaming phenomenon

6. No residual solids and no foaming

Application Field

Application field of Beipeng ® XPS & SXPS

Wall insulation:

1) Extruded sheet thin plastering external wall insulation system

2) Extruded board single-sided composite gypsum board external wall insulation system

3) Ultra-low energy consumption building wall insulation

4) Cold storage wall insulation


Roof insulation:

1) Concrete inverted roof system, concrete upright roof system, concrete cold storage roof

2) Steel structure flexible roof system, steel structure cold storage roof


Floor insulation:

1) Square ground, high-speed railway platform

2) Wet floor heating system

3) Cold storage floor

4) Protection of highway subgrade frozen soil and prevention and control of freezing damage


Underground insulation:

1) Basement side wall

2) Soil protection

3) Lightweight backfill


Temperature retaining core material:

1) PC-component exterior wall panel of prefabricated building

2) Integrated system temperature retaining core material

3) Decorative insulation integrated system core material

4) Refrigerated truck


Special application:

1) Food and pharmaceutical packaging

2) High-speed rail type II ballastless track

3) Water conservancy engineering

4) Others

 
 
Detailed Photos

Beipeng Ultra-Low Thermal Conductivity XPS Insulation Board Suitable for Food Factory ConstructionBeipeng Ultra-Low Thermal Conductivity XPS Insulation Board Suitable for Food Factory ConstructionBeipeng Ultra-Low Thermal Conductivity XPS Insulation Board Suitable for Food Factory Construction
Beipeng Ultra-Low Thermal Conductivity XPS Insulation Board Suitable for Food Factory ConstructionBeipeng Ultra-Low Thermal Conductivity XPS Insulation Board Suitable for Food Factory Construction

Our Advantages

Beipeng Ultra-Low Thermal Conductivity XPS Insulation Board Suitable for Food Factory Construction

Beipeng Ultra-Low Thermal Conductivity XPS Insulation Board Suitable for Food Factory Construction


 

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