Extruded Polyethylene Foam (XPS) Thermal Insulation Material

US$35.00 - 180.00 500 cubic meter (MOQ)
Port:
Tianjin, China
Production Capacity:
2000/Cbm
Payment Terms:
T/T

Last Login Date:

Jul 21, 2025

Main Products:

XPS Foam Board, Graphite Extruded Insulation Board, Floor Heating Board, Polyurethane Sandwich Board, Rock Wool Board, Composite Rock Wool Board, Lightweight Partition Board, Nachor Nail, Fiberglass Cloth, Dry Mortar Series

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Product Description

Company Info

Basic Info.

Model NO.
XPS Foam Board
Warranty
10 Years
Type
Profiled
Material
Application
Structural Components, Functional Components, Insulation
Material Properties
Flame Retardant
Markets Served
Building & Construction
Customized
Customized
Usage
Internal
Color
Yellow
Surface Finishing
Finished
Thermal Conductivity
0.027
Figra
72W/S
Oxygen Index
32.5%
Compressive Strength
200~1000 Kpa
Thermal Resistance
0.96 (M2`K)/W
Water Absorption
0.4% (96h)
Trademark
Beipeng
Origin
China
HS Code
3921110000

Product Description

Product Description

XPS foam board is a kind of rigid extruded polystyrene thermal insulation material. Taking polystyrene resin as the main component, adding a certain proportion of additives, through the Berstorff imported production line, in strict accordance with the ISO quality management system control conditions, heating extrusion molding by a special process, products are formed with a honeycomb shape finally. High performance rigid foam with closed cell structure.

Due to the special honeycomb structure of the product, the interconnecting walls have a certain thickness without voids. The final extrusion forms a product with a uniform structure and excellent thermal insulation performance, and the product itself has good high compression resistance, moisture resistance and moisture resistance.

Producing Process

 

1. Heftynest extruded board process-CO2 foaming process

2. The cells are small and uniform in size

3. The link wall between the cells is uniform in thickness

4. High closed cell rate

5. No secondary foaming phenomenon

6. No residual solids and no foaming


 

Beipeng XPS Foam Board Specification
Thermal ConductivityW/m2·K≤0.030
Dimensional stability%≤1.5
Compressive strengthkPa200250300350400450500600800
Tensile strengthMpa0.20
Water absorption%≤1.5
Combustion performance B1, B2
Densitykg/m222-35Customization is accaptable
Lengthmm12002400
Widthmm6001200
Thicknessmm20    25   30    4050    60    70    8090   100120   130
 
 
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