Flexible XPS Styrofoam Wall Panels Soundproof Extruded Polystyrene Insulation XPS Foam Board Tile Backer Board

• Warranty: 10 Years
• Type: Profiled
• Material: Polystyrene
• Shipping Cost: Estimated freight per unit.: about shipping cost and estimated delivery time.
• Currency: US$
• Return&refunds: You can apply for a refund up to 30 days after receipt of the products.
• Model NO.: EPS Foam Board
• Application: Structural Components, Functional Components, Insulation
• Material Properties: Flame Retardant
• Markets Served: Building & Construction
• Customized: Customized
• Usage: Internal
• Color: Yellow
• Surface Finishing: Finished
• Thermal Conductivity: 0.027
• Figra: 72W/S
• Oxygen Index: 32.5%
• Compressive Strength: 200~1000 Kpa
• Thermal Resistance: 0.96 (M2`K)/W
• Water Absorption: 0.4% (96h)
• Trademark: Beipeng
• Origin: China
• HS Code: 3921110000
• Production Capacity: 2000/Cbm

Product Description

Product Description

XPS foam board is a kind of rigid extruded polystyrene thermal insulation material. Taking polystyrene resin as the main component, adding a certain proportion of additives, through the Berstorff imported production line, in strict accordance with the ISO quality management system control conditions, heating extrusion molding by a special process, products are formed with a honeycomb shape finally. High performance rigid foam with closed cell structure.

Due to the special honeycomb structure of the product, the interconnecting walls have a certain thickness without voids. The final extrusion forms a product with a uniform structure and excellent thermal insulation performance, and the product itself has good high compression resistance, moisture resistance and moisture resistance.

Producing Process

 

1. Heftynest extruded board process-CO2 foaming process

2. The cells are small and uniform in size

3. The link wall between the cells is uniform in thickness

4. High closed cell rate

5. No secondary foaming phenomenon

6. No residual solids and no foaming


 

Beipeng XPS Foam Board Specification
Thermal Conductivity	W/m^2·K	≤0.030
Dimensional stability	%	≤1.5
Compressive strength	kPa	200	250	300	350	400	450	500	600	800
Tensile strength	Mpa	≥0.20
Water absorption	%	≤1.5
Combustion performance		B1, B2
Density	kg/m^2	22-35						Customization is accaptable
Length	mm	1200			2400
Width	mm	600			1200
Thickness	mm	20    25	30    40	50    60	70    80	90   100	120   130

 

 

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